Lg= 60 nm In0.53Ga0.47As MBCFETs: From gm-max= 13.7 mS/μm and Q = 180 to virtual-source modeling

  • Yoo, Ji-hoon; 
  • Jo, Hyeon Bhin; 
  • Lee, In-geun; 
  • Choi, Su-min; 
  • Baek, Ji-min; 
  • ... Kim, Daehyun; 
  • 외 21명
Citations

SCOPUS

1

초록

In this paper, we report scalable 5 -level stacked gate-all-around (GAA) In 0.53 Ga0.47As multi-bridge channel FETs (MBCFETs), with careful attention paid to fluorine migration. At its heart, we maintained temperature of all the unit process steps below 300 °C and inserted an n-InP ledge into a top In0.52Al0.48As sacrificial layer to suppress F- -induced donor passivation. In addition, we used a selectively regrown n+In0.53Ga0.47 As contact formation by MOCVD and precision dry etching. The dry etching process resulted in a highly vertical etching slope along both the S/D and Wg directions. The fabricated Lg=60nm MBCFET showed a record combination of S=76mV/dec, gm-max=13.7 mS/mum, ION=2.24mA/mum and Q=180 at VDS=0.5V. © 2023 JSAP.

제목
Lg= 60 nm In0.53Ga0.47As MBCFETs: From gm-max= 13.7 mS/μm and Q = 180 to virtual-source modeling
저자
Yoo, Ji-hoon; Jo, Hyeon Bhin; Lee, In-geun; Choi, Su-min; Baek, Ji-min; Lee, Sang-tae; Jang, Hyunchul; Kong, M. W.; Kim, H. H.; Lee, H. J.; Kim, Hyojin; Jeong, Hyeon-seok; Park, Wan-soo; Ko, Daehong; Shin, Seungheon; Kwon, Hyukmin; Kim, Sang-kuk; Kim, Jae-gyu; Yun, Jacob; Kim, T.; Shin, Ki-yong; Kim, Taewoo; Shin, Jang-kyoo; Lee, Jaehak; Shin, Chan-soo; Seo, Kwangseok; Kim, Daehyun
DOI
10.23919/VLSITechnologyandCir57934.2023.10185250
발행일
2023
유형
Conference paper
저널명
Digest of Technical Papers - Symposium on VLSI Technology
권
2023-June