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Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
- Choi, Jungrak;
- Han, Chankyu;
- Lee, Donho;
- Kim, Hyunjin;
- Lee, Gihun;
- ... Jeong, Yongrok;
- 외 7명
WEB OF SCIENCE
14SCOPUS
13초록
The demand for tactile sensors in robotics, virtual reality, and health care highlights the need for high performance and customizability. Despite advances in vision-based technologies, tactile sensing remains crucial for precise interaction and subtle pressure detection. In this work, we present a design and fabrication method of customizable tactile sensors based on thermoformed three-dimensional electronics. This approach enables ultrawide modulus tunability (10 pascals to 1 megapascal) and superior mechanical properties, including negligible hysteresis and high creep resistance. These features allow the sensor to detect a broad spectrum of pressures, from acoustic waves to body weight, with high performance. The proposed sensors have high sensitivity (up to 5884 per kilopascal), high linearity (R2 = 0.999), low hysteresis (<0.5%), and fast response (0.1 milliseconds). We demonstrate applications in human-computer interaction and health care, showcasing their potential in various fields. This platform provides a scalable solution for fabricating versatile, high-performance tactile sensors.
키워드
- 제목
- Thermoforming 2D films into 3D electronics for high-performance, customizable tactile sensing
- 저자
- Choi, Jungrak; Han, Chankyu; Lee, Donho; Kim, Hyunjin; Lee, Gihun; Ha, Ji-Hwan; Jeong, Yongrok; Ahn, Junseong; Park, Hyunkyu; Han, Hyeonseok; Cho, Seokjoo; Gu, Jimin; Park, Inkyu
- 발행일
- 2025-05-14
- 유형
- Article
- 저널명
- Science Advances
- 권
- 11
- 호
- 20
- 언어
- ENG
- 출판사
- AMER ASSOC ADVANCEMENT SCIENCE
- 발행국가
- 미국
- ISSN
- E 2375-2548
P 2375-2548