태양광 리본용 저융점 Sn-In (wt%) 무연 솔더 연구

초록

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn48In52 (wt%) existed in InSn4 and In3Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn4 phase (γ-alloy) existed separately from the In3Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn48In52 (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn42In58 (wt%) solder was 38.7 N/mm2, and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn48In52 (wt%) solder was 53.6 N/mm2, and that of the Sn51In49 (wt%) solder was 61.6 N/mm2 that was the highest.

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