Improvement in tensile strength of extruded Mg-5Bi alloy through addition of Sn and its underlying strengthening mechanisms

초록

Through an investigation of the microstructure and mechanical properties of extruded Mg-5Bi-xSn (BT5x, x = 0, 2, 4, and 6 wt%) alloys, this study demonstrates that the addition of Sn to an Mg-5Bi binary alloy significantly improves the tensile strength of the extruded alloy. All the extruded alloys exhibit a typical basal fiber texture and a partially dynamically recrystallized (DRXed) microstructure consisting of fine DRXed grains and coarse unDRXed grains. As the Sn content increases from 0 wt% to 6 wt%, the average size of the DRXed grains decreases from 4.2 to 2.8 mu m owing to the increase in the amount of precipitates via their grain-boundary pinning effect. The extruded B5 and BT52 alloys contain numerous Mg3Bi2 precipitates, but their size and number density are smaller and higher, respectively, in the latter alloy. Numerous Mg2Sn precipitates as well as Mg3Bi2 precipitates are present in the extruded BT54 and BT56 alloys, and the number density of the Mg2Sn precipitates is higher in the latter alloy because of its higher Sn content. The addition of 2 wt% Sn to the B5 alloy significantly improves the yield strength (YS) and ultimate tensile strength (UTS) of the extruded alloy-by 76 and 57 MPa, respectively. This drastic improvement is the combined outcome of enhanced grain-boundary hardening, precipitation hardening, and solid-solution hardening effects induced by the refined DRXed grains, numerous precipitates, and Sn solute atoms, respectively. The further addition of 2 wt% or 4 wt% Sn to the BT52 alloy leads to moderate increments in the YS and UTS of the extruded alloy. Specifically, each addition of 2 wt% Sn increases the YS and UTS by tilde 26 and tilde 20 MPa, respectively, which is attributed mainly to the additional precipitation hardening effect induced by the Mg2Sn precipitates.(c) 2021 Chongqing University. Publishing services provided by Elsevier B.V. on behalf of KeAi Communications Co. Ltd. This is an open access article under the CC BY-NC-ND license ( http://creativecommons.org/licenses/by-nc-nd/4.0/ ) Peer review under responsibility of Chongqing University

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