페닐렌 디아민의 아렌 대체 패턴에 따른 에폭시 수지의 경화 거동과 열 및기계적 특성 연구

초록

To study the effect of arene substitution patterns of phenylenediamines, ascuring agents, on curing behaviors, thermal and mechanical properties of epoxy resins,DGEBF(Diglycidyl ether of bisphenol F) and o, m, p-phenylenediamine(PDA) were selected. Thecure kinetics of epoxy mixtures were analyzed under both dynamic and isothermal conditionsusing differential scanning calorimetry(DSC). The activation energy and curing initiationtemperature were found to be lowest with p-PDA and highest with o-PDA and it resulted thatthe degree of cure and curing rate were highest and fastest with p-PDA and lowest with o-PDA. Tg and thermal stability of the epoxy samples were better with o-PDA and m-PDA than p-PDA. Tensile strength and fracture toughness were highest with m-PDA and lowest with p-PDA. These results indicated that m-PDA could be the best curing agent of isomeric PDAs. Andmechanical properties of the epoxy resin could be different only by the isomeric structures ofcuring agents.

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