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Thermal Cure Kinetics of Modified Cold-Setting Melamine-Urea-Formaldehyde Resins with Liquid Thickeners
- Sereni, Kyle J.;
- Lee, Jaewook;
- Park, Byung‑Dae
SCOPUS
0초록
Cold-setting melamine-urea-formaldehyde (CS-MUF) resins being used as adhesives for manufacturing laminated wood timber products require to have a proper viscosity using thickener or filler. However, studies on thermal curing kinetics and behavior of the modified CS-MUF resins with liquid thickener are limited. Hence, this study focuses on the thermal cure kinetics of the modified CS-MUF resins with two liquid thickeners at three addition levels to obtain the resin viscosities of 4,000 mPa.s, 8,000 mPa.s and 12,000 mPa.s. Differential scanning calorimetry (DSC) was used to estimate cure kinetics of the modified CS-MUF resins using two analysis methods: 1) model-fitting (MFT) method containing the Kissinger (KSNG) analysis, and 2) model-free (MFK) methods containing Kissinger-Akahira-Sunose (KAS) analysis, and nonlinear isoconversional (VYA) analysis. The KSNG, KAS, and VYA analysis showed that all modified CS-MUF resins followed very similar curing behavior with small difference, except Resin #2 which followed the autocatalytic reaction model based on the Málek method. These results suggest that liquid thickeners increase to a proper viscosity of CS-MUF resins without major impact to their curing behavior. © 2024 Sereni et al.
키워드
- 제목
- Thermal Cure Kinetics of Modified Cold-Setting Melamine-Urea-Formaldehyde Resins with Liquid Thickeners
- 저자
- Sereni, Kyle J.; Lee, Jaewook; Park, Byung‑Dae
- 발행일
- 2024-02
- 유형
- Article
- 권
- 13
- 페이지
- 272 ~ 281
- 언어
- ENG
- 출판사
- Lifescience Global
- 발행국가
- 캐나다
- 분량
- 10 페이지
- ISSN
- E 1929-5995