태양광 리본용 Sn48In52Agx (wt%) 저융점 솔더의 특성에 미치는 Ag의 영향

초록

We have studied the effects of Ag on the characteristics of Sn48In52Agx (wt%) low-melting solders for photovoltaic ribbons. The Sn48In52 (wt%) solder coexisted in the InSn4 and In3Sn alloys. Ag atoms added in the solder formed an AgIn2 alloy by reacting with some part of In atoms, while they did not react with Sn atoms. The addition of Ag atoms in the Sn48In52Agx (wt%) solders showed useful results; an increase in peel strength and a decrease in melting temperature. The peel strength of the ribbon plated with the Sn48In52 (wt%) solder was 53.6 N/mm2, and that of the Sn48In52Ag1 (wt%) solder largely increased to 125.1 N/mm2. In the meanwhile, the melting temperature of the Sn48In52 (wt%) solder was 119.2℃, and that of the Sn48In52Ag1 (wt%) solder decreased to 114.0℃.

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