Smart Mechanical Structures and Design for Advanced Adhesives: A Review

  • Kim, Jaeil; 
  • Choi, Geonjun; 
  • Park, Seongjin; 
  • Kim, Minwook; 
  • Kim, Kwangjun; 
  • ... Kwak, Moon Kyu; 
  • 외 3명
Citations

WEB OF SCIENCE

5
Citations

SCOPUS

5

초록

Smart adhesives with engineered mechanical structures have emerged as a transformative technology with broad applications in fields such as wearable healthcare devices, bioengineering, and soft robotics. By integrating advanced mechanical architectures like kirigami, tessellations, and multilayered designs, these adhesives exhibit enhanced surface and mechanical properties that lead to superior interfacial adhesion. Such designs offer critical advantages—improved stretchability, substrate conformability, and increased adhesion strength—over conventional adhesives. This review explores the range of engineered structures used in smart adhesives and demonstrates how these innovations address the limitations of traditional adhesives. Additionally, we discuss their applications in wearable healthcare devices, flexible electronics, and robotics.

키워드

Smart adhesive; Engineered mechanical structure; Kirigami; Tessellation; Multilayer adhesive; STRATEGIES; SHAPE
제목
Smart Mechanical Structures and Design for Advanced Adhesives: A Review
저자
Kim, Jaeil; Choi, Geonjun; Park, Seongjin; Kim, Minwook; Kim, Kwangjun; Jung, Ho-Sup; Kwak, Moon Kyu; Ok, Jong G.; Jeong, Hoon Eui
DOI
10.1007/s12541-025-01211-y
발행일
2025-03
유형
Review
저널명
International Journal of Precision Engineering and Manufacturing
권
26
호
3
페이지
757 ~ 772